Coining Acquires SPM

January 22, 2009

Coining announced today that it has completed the acquisition of SEMX Corporation, parent of SPM in Armonk, NY. Like Coining, SPM manufactures a broad range of solder preforms and other miniature metal stamped components used for microelectronic packaging and assembly applications in the medical device, telecommunications, semiconductor, microwave, military, aerospace, industrial and automotive markets.

"The combination of Coining and SPM makes us an even stronger supplier and partner to our customers," explains Coining CEO Gary Holcomb. "In addition, we add SPM's aluminum, copper and gold wire products to Coining's portfolio plus the capability to package stampings in a tape and reel configuration internally."

"We are excited to be joining Coining," remarks Vito Tanzi, SPM's Executive Vice President. "We have known and respected each other for years. Both companies are headquartered in the New York metropolitan area, facilitating integration."

SEMX Corporation is a leading manufacturer of solder preforms, jumper chips, bonding pads, heat sinks, lead frames, solder spheres, bonding wire and ribbon for microelectronics packaging and assembly. The company maintains facilities in Armonk, NY; Penang, Malaysia; and Casablanca, Morocco, serving about 400 customers worldwide.

Coining, Inc. is the largest manufacturer of solder and brazing preforms for microelectronic packaging and assembly worldwide. From its facility in Saddle Brook, NJ located about 20 miles west of New York City, the company supplies solder preforms, microstampings and cover assemblies to more than 400 customers in twenty-five countries.

For more information about Coining, please visit www.coininginc.com or email sales@coininginc.com.