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Gold Bonding Wire



Gold Bonding Wire





Gold Bonding Wire & Ribbon

Gold Bonding Wire

Wire

Coining's gold wire standards are unsurpassed in the industry. We manufacture gold wire in diameters as small as 0.0005 inch (12.5 microns), with highly uniform elongation, tensile strength and dimensional properties. All of our high purity wire products are produced from highly refined, vacuum-processed metals.

Wire for automatic bonders is a Coining specialty.


Standard Wire Specifications

Diameter

Elongation

Minimum Break Load (g)

Minimum Break Load (g)

Temper Condition

Inches

Microns

%

Type B1

Type B2

0.0005

12.5

0.5 – 1.5

5

N/A

Hard

2.0 – 5.0

2

N/A

Annealed

0.0007

18

0.5 – 2.0

9.5

8

Hard

1.0 – 3.0

5

4

Stress Relieved

3.0 – 5.0

3

2.5

Annealed

0.0008

20

0.5 – 2.0

12.5

10

Hard

1.0 – 3.0

6

5

Stress Relieved

4.0 – 6.0

4

3

Annealed

0.001

25

0.5 – 2.5

21

20

Hard

1.0 – 3.0

11

10

Stress Relieved

4.0 – 6.0

8

7

Annealed

0.0013

33

0.5 – 2.5

33

30

Hard

1.0 – 3.0

17

15

Stress Relieved

5.0 – 7.0

12

10

Annealed

0.0015

38

0.8 – 3.0

45

40

Hard

1.0 – 3.0

24

20

Stress Relieved

6.0 – 8.0

18

16

Annealed

0.002

50

1.0 – 3.0

75

70

Hard

1.0 – 3.5

45

40

Stress Relieved

2.0 – 8.0

30

25

Annealed

Note: Other specific requirements can be achieved upon request.


Pure gold wire doped with controlled amounts of beryllium and other elements is normally used for ball bonding. This process brings together the two materials that are to be bonded using heat, pressure and ultrasonic energy. The most common approach in thermosonic bonding is to ball-bond to the chip, then stitch-bond to the substrate. Very tight controls during our processing enhance looping characteristics and eliminate sagging.


Junction size, bond strength and conductivity requirements typically determine the most suitable wire size for a specific wire bonding application. Coining manufactures gold wire in diameters from 0.0005 inch (12.5 microns) and larger. Production tolerance on gold wire diameter is +/-3%.

Ribbon

Ribbons of pure gold and base metals for microwave and other applications are also available from Coining and are custom manufactured to the customer's specifications. As with wire, many of the base metals in ribbon form can be supplied plated or clad with other metals for PC board repair and other applications.


Ribbon Type

Width (Inch)

Thickness (Inch)

Rolled Narrow

0.002 – 0.010

0.00025 – 0.002

Slit

0.025 – 0.100

0.0005 – 0.002

Rolled Wide

0.010 – 0.025

0.0005 – 0.003

Tolerance

+/- 3%

+/- 10%

Note: Many other wires and ribbons in various alloys are available for customer-specific applications. All materials that Coining produces are analyzed for chemical properties; impurity levels are measured in PPM. Please contact us for additional details.

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Microelectronics Interconnect Materials:  Bonding Wire and Ribbon