Microelectronics Bonding Wire & Ribbon

Coining wire and ribbon are widely used as electrical interconnect materials in manufacturing microelectronic devices. These products facilitate a bond between a chip and substrate or between two chips. The specific materials described below are of the highest quality, refined and alloyed by Coining to produce the demanding properties of finished wire and ribbon products:

Gold Wire & Ribbon

Aluminum and Silicon Aluminum Wire & Ribbon

SPM Power Bond Ribbon™

Copper Wire

Spool Specifications

Coining can spool on all standard spools. In addition, we often use a special spool we have for large diameter material. Up to 5,000 feet of gold or silicon/aluminum wire can be supplied on a standard 2 inch diameter spool. Our new special spool for large diameter aluminum wire can hold up to 4,000 feet of 0.005 inch diameter wire.




Spool Specifications

			A	A	B	C	D	E	F
			Flange	Flange	Hub	Barrel
Spool		Spool	Diam.	Diam.	Diam.	Diam.	Flange		Spool
No.	Type	Material	(mm)	(inch)	(inch)	(inch)	Thick.	Traverse	Width
25PS	5 lb	Polystyrene	123.8	4.875	0.625	2.875	0.250	3.250	3.750
41B	4" Glass Filled	Glass Filled ABS	117.5	4.625	0.437	4.000	0.915	0.665	0.861
41C	4" Glass Filled	Glass Filled ABS	117.5	4.625	0.437	4.000	0.098	1.580	1.776
24PS	1 lb	Polystyrene	63.5	2.500	0.625	1.750	0.187	3.000	3.374
20PS	2" White	Polystyrene	63.5	2.500	0.375	1.765	0.190	1.000	1.380
FFI	Foil Feed	Lucite	63.5	2.500	0.390	1.500	0.090	Adjustable	Adjustable
12 AL	2" AL–DF	Aluminum	56.9	2.240	1.930	1.980	0.025	1.000	1.127
13 AL	2" AL–SF	Aluminum	56.9	2.240	1.930	1.980	0.025	1.035	1.100
14 AL	1.750" AL-SF	Aluminum	56.8	2.235	1.930	1.980	0.025	1.760	1.875
11 AL	0.5" AL-DF	Aluminum	17.3	0.680	0.500	0.525	0.0125	0.720	0.745